Not Just Chips: Retrospective on MEMS packaging - challenges to be considered / chalenges to be...
33:58
Not Just Chips: Silicon Photonics Chiplet Package - Optical Assembly
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Not Just Chips: The Challenges of Scaling Beyond Moore’s Law and Into the World of 3DHI
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Micromachining Overview - How MEMS are Made
45:15
High Speed and RF Design Considerations
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Tecnar's advanced cold spray sensors technologies - An integration in industry 5.0 CSAM platform
34:28
Not Just Chips: Novel Techniques for IC Integration and Packaging Using Additive Technologies
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Not Just Chips: Enabling high volume data communication – solving the new challenges in PIC wafer...
14:57