Expert Session: Recycled Plastics in Electronics - Challenges & Opportunities
26:23
Expert Session: New Materials in the Semiconductor Industry – Challenges for Sustainable Production
24:54
Expert Session: Highly reliable Interconnect Processes for Power Electronics
32:20
Green ICT Online-Seminar 05: Sustainability in Information and Communication Technologies
42:05
Expert Session: Fan-out Wafer & Panel Level Packaging: Platform for Gen 2/2.5 D Packaging Solutions
1:03:30
From Linear to Circular: AI’s Role in Shaping the Future of Consumption.
27:16
Expert Session: Glass Core Substrates
55:26
Green ICT Online-Seminar 04: From CMOS Fabrication to Advanced Packaging – Ecological Aspects
43:35