Mike Zajaczkowski DMA mini lecture Final
12:39
these are the only perfect squares
58:36
Using Dynamic Mechanical Analysis to Characterize Glass-to-Rubber Softening Transition of Polymers
53:59
Semiconductors - Thermal Analysis in electronics - Live Webinar
4:49
Superconductivity - Zhibin Wang
23:07
Resistance Spot Welding and Whisker (surface defects) formation
26:39
Final IO ENG 4K
20:45
Numerical Simulation of Laser Shock Disassembly of Adhesively Bonded CFRP/Metallic Parts
3:36