NanoFocus µsprint: Fully automated wafer inspection

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ViTrox_Advanced 3D Optical Inspection system (AOI)

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Trump Blows Up Over TACO Nickname, Demands Apology from 60 Minutes & Elon Leaves Washington

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[Eng Sub] Wafer Bumping Process: Solder bump, Cu pillar bump, UBM

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eSL10™ E-beam Wafer Defect Inspection System

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From Wafer to Chip:Next Generation Inspection and Metrology Solutions for the Semiconductor Industry

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NanoFocus AG: Einsatz der 3D-Oberflächenmesstechnik von NanoFocus bei ThyssenKrupp Steel

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25 Innovative Products From The 1960s That FAILED Miserably!

3:14